fnctId=curriculum,fnctNo=107
| Grade | Semesters | Category | Course Title | Credit |
|---|---|---|---|---|
| Common | 1 | RISE | 3 | |
| 2 | INTERNSHIP(Ⅲ-1) | 6 | ||
| INTERNSHIP(Ⅴ-1) | 12 | |||
| 1 | 1 | CALCULUS(1) | 3 | |
| University chemistry | 3 | |||
| Physics(1) | 3 | |||
| 2 | Major Basic | INTRODUCTION TO MATERIALS ENGINEERING | 3 | |
| CALCULUS(2) | 3 | |||
| Physics(2) | 3 | |||
| 2 | 1 | Basic Electrochemistry | 3 | |
| MODERN PHYSICS | 3 | |||
| INTRODUCTION TO METALLURGY | 3 | |||
| Major Basic | Introduction to Energy Materials and Engineering | 3 | ||
| Introduction to Electronic Materials Engineering | 3 | |||
| 2 | Advanced Materials Science Lab(1) | 1 | ||
| CRYSTAL STRUCTURE OF MATERIALS | 3 | |||
| STRUCTURE AND DEFECTS OF THE SOLIDS | 3 | |||
| SEMICONDUCTOR PHYSICS | 3 | |||
| Energy Devices and Processing | 3 | |||
| MECHANICS OF METERIALS | 3 | |||
| MICROELECTRONIC PACKAGING | 3 | |||
| Major Basic | Mathematics for Materials Science and Engineering | 3 | ||
| PHYSICAL CHEMISTRY FOR MATERIALS SCIENCE(1) | 3 | |||
| 3 | 1 | Advanced Materials Science Lab(3) | 1 | |
| ELECTRICAL PROPERTIES OF THE MATERIALS | 3 | |||
| Numerical analysis for materials science | 3 | |||
| Microelectronic Processing | 3 | |||
| PHASE TRANSFORMATION | 3 | |||
| Energy Materials | 3 | |||
| PHYSICAL CHEMISTRY FOR MATERIALS SCIENCE(2) | 3 | |||
| THE MAGNETIC AND OPTICAL PROPERTIES OF MATERIALS | 3 | |||
| Electronic Materials | 3 | |||
| 2 | Advanced Materials Science Lab(2) | 1 | ||
| Advanced Materials Science Lab(4) | 1 | |||
| NANOPROCESSING | 3 | |||
| SEMICONDUCTOR DIVICE ENGINEERING | 3 | |||
| MECHANICAL PROPERTIES OF CERAMICS | 3 | |||
| CHARACTERIZATION OF MATERIALS | 3 | |||
| Computational Materials Science | 3 | |||
| RARE EARTH METALS | 3 | |||
| 4 | 1 | Advanced Materials Science Lab(5) | 1 | |
| POWDER METALLURGY | 3 | |||
| POWDER ENGINEERING | 3 | |||
| Spin and Magnetic Materials | 3 | |||
| Materials Thermodynamics | 3 | |||
| VACUUM ENGINEERING | 3 | |||
| 2 | Advanced Materials Science Lab(6) | 1 | ||
| THIN FILM MATERIALS | 3 | |||
| Semiconductor materials and devices | 3 | |||
| ELECTRONIC PACKAGING | 3 | |||
| AMORPHOUS MATERIALS | 3 | |||
| Hydrogen Fuel Cell Engineering | 3 | |||
| MATERIALS FOR INFORMATION STORAGE | 3 |